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Phase-change Memory (also Referred to as PCM

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작성자 Nida 댓글 0건 조회 10회 작성일 25-12-28 05:44

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Memory-Internal.jpgSection-change memory (also called PCM, PCME, PRAM, PCRAM, OUM (ovonic unified memory) and C-RAM or CRAM (chalcogenide RAM)) is a sort of non-unstable random-entry memory. PRAMs exploit the unique behaviour of chalcogenide glass. In PCM, heat produced by the passage of an electric current by means of a heating element typically made of titanium nitride is used to either rapidly heat and quench the glass, making it amorphous, or to carry it in its crystallization temperature vary for a while, thereby switching it to a crystalline state. Latest analysis on PCM has been directed in direction of searching for viable materials options to the section-change materials Ge2Sb2Te5 (GST), with blended success. Other analysis has targeted on the development of a GeTe-Sb2Te3 superlattice to realize non-thermal phase adjustments by altering the co-ordination state of the germanium atoms with a laser pulse. This new Interfacial Part-Change Memory (IPCM) has had many successes and continues to be the location of a lot active analysis.



Leon Chua has argued that each one two-terminal non-unstable-memory devices, together with PCM, should be thought of memristors. Stan Williams of HP Labs has additionally argued that PCM should be considered a memristor. However, this terminology has been challenged, and the potential applicability of memristor idea to any physically realizable device is open to query. Within the 1960s, Stanford R. Ovshinsky of Power Conversion Devices first explored the properties of chalcogenide glasses as a potential memory expertise. In 1969, Charles Sie published a dissertation at Iowa State University that each described and demonstrated the feasibility of a section-change-memory system by integrating chalcogenide film with a diode array. A cinematographic research in 1970 established that the phase-change-memory mechanism in chalcogenide glass includes electric-area-induced crystalline filament progress. Within the September 1970 concern of Electronics, Gordon Moore, co-founder of Intel, revealed an article on the technology. Nonetheless, materials high quality and power consumption issues prevented commercialization of the technology. Extra lately, curiosity and analysis have resumed as flash and DRAM memory technologies are expected to encounter scaling difficulties as chip lithography shrinks.



The crystalline and amorphous states of chalcogenide glass have dramatically completely different electrical resistivity values. Chalcogenide is identical materials used in re-writable optical media (comparable to CD-RW and DVD-RW). In those situations, the material's optical properties are manipulated, quite than its electrical resistivity, as chalcogenide's refractive index also modifications with the state of the material. Though PRAM has not yet reached the commercialization stage for consumer electronic units, nearly all prototype devices make use of a chalcogenide alloy of germanium (Ge), antimony (Sb) and tellurium (Te) called GeSbTe (GST). The stoichiometry, or Ge:Sb:Te element ratio, is 2:2:5 in GST. When GST is heated to a excessive temperature (over 600 °C), its chalcogenide crystallinity is lost. By heating the chalcogenide to a temperature above its crystallization point, but beneath the melting point, it'll remodel right into a crystalline state with a a lot decrease resistance. The time to complete this section transition is temperature-dependent.



Cooler portions of the chalcogenide take longer to crystallize, and overheated portions may be remelted. A crystallization time scale on the order of one hundred ns is usually used. That is longer than typical volatile Memory Wave Program gadgets like trendy DRAM, which have a switching time on the order of two nanoseconds. Nevertheless, a January 2006 Samsung Electronics patent utility indicates PRAM may obtain switching instances as fast as five nanoseconds. A 2008 advance pioneered by Intel and ST Microelectronics allowed the fabric state to be more carefully managed, permitting it to be transformed into one of four distinct states: the earlier amorphous or crystalline states, together with two new partially crystalline ones. Every of those states has completely different electrical properties that may be measured during reads, permitting a single cell to characterize two bits, doubling memory density. Phase-change memory units based mostly on germanium, antimony and tellurium present manufacturing challenges, since etching and sharpening of the fabric with chalcogens can change the fabric's composition.



Supplies primarily based on aluminum and antimony are more thermally stable than GeSbTe. PRAM's temperature sensitivity is probably its most notable drawback, one that will require adjustments within the manufacturing technique of manufacturers incorporating the technology. Flash memory works by modulating charge (electrons) saved inside the gate of a MOS transistor. The gate is constructed with a special "stack" designed to entice prices (either on a floating gate or in insulator "traps"). 1 to zero or 0 to 1. Changing the bit's state requires removing the accumulated charge, which demands a relatively massive voltage to "suck" the electrons off the floating gate. This burst of voltage is supplied by a cost pump, which takes some time to construct up energy. Normal write times for Memory Wave Program frequent flash devices are on the order of a hundred μs (for a block of data), about 10,000 instances the typical 10 ns learn time for SRAM for example (for a byte).

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